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| Okano
808 Adhesive Glue |
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Introduction |
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> Introduction
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During
FPC (Flexible PCB), high temperature tape is usually used to |
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secure
the FPC on the PCB carrier. This process had created
the |
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following
issues for the FPC production : |
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Residual tape glue on FPC |
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FPC warps during reflow oven process, no solder on
component |
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due to component shifts. |
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Longer delivery schedule due to poor passing rate. |
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Cost of production increases, unable to improve effectively |
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Okano
808 Adhesive Glue is able to help you to improve your FPC |
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production
efficiency significantly. |
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1
Place the FPC on top of the FPC carrier with tinted layer
of |
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Okano 808 adhesive glue. |
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2
Ensure the FPC lay down flatten on the FPC carrier by using
a |
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roller. |
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3
Remove the FPC from the FPC carrier after reflow oven. |
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4
FPC carrier with the layer of Okano 808 is ready to use again. |
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Advantages
of using Okano 808 adhesive glue |
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Good
Adhesive Characteristics |
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Okano 808 adhesiveness can be mixed accordingly based on |
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different FPC thickness to ensure no warp on FPC during
placement |
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or removal from FPC carrier. |
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No
Glue Residue |
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Special high temperature materials had been used, no glue
residue |
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SGS
RoHS |
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Pass SGS RoHS inspection, Inspection report :CE/2005/B5924A |
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Improve
Production Efficiency |
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Good adhesive characteristics, repeatable use |
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Okano 808 adhesive glue can be easily remove |
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FPC carrier can be used again after adhesive glue re-paint. |
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Improve
FPC Passing Rate |
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FPC
can be placed perfectly on top of the FPC carrier, reduce FPC |
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warp
and no solder on component problem during FPC process. |
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Specification
subject to change without notice |
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