Features

HIGH RESOLUTION / HIGH SPEED
The high-precision CCD camera which has a high resolution of 1.3 million pixels enables a wide visual field (19.3 x 15.5mm) while still maintaining its high resolution (15.5um). The inspection tact is twice of existing machines. Of course, it can also accommodate lead inspections for 0201 chips and 0.3mm QFP. In addition, the inspection images, having become color, have lead to remarkable improvements in the detection of NG points.

"MOSAIC" COLOR PROCESSING

With color images, inspection involves the extraction out of the component colors using "MOSAIC" technology. Its color determination enables stable inspection results of the parts that used to produce unstable results due to similar contrasts of the part and the printed board. Our newly developed image processing board has also lead to a speeding up of image processing.

SHORTER DATA GENERATING TIME

Reforming this system from one which involved two monitors as in the past into one with only one monitor had led to improved operation.
By preparing a component with directional character so that it faces one direction at first and then allowing automatic correction for the other directions, we have reduced the number of different components that have to be initially prepared.
Our inspection program can also utilizes our process packaging system according to inspection items (eg. flawed components, slippage, solder inspection etc.), enabling much easier and faster program creation.

AUTOMATIC WINDOW FACILITY

A flexible PWB ensures that s shift of the window can be corrected automatically so that it corresponds to the real PWB.

ANGLED COMPONENTS

Angled components can be inspect. The window can be rotated by a single degree.

SILK DETECTION

Only the silk parts can be deleted without affecting bridges.

RELIABLE QUALITY AND EXPERIENCE

The reliability of our CPC series is demonstrated by the fact that we have delivered over 1,300 machines to date.