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| ESV-505
Vision Tester |
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Features |
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>
Introduction
> Features
> Specification
> Overall Dimensions
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Previous Model FOV 16 x 15mm |
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3.0M
Pixels High Resolution Camera
High speed inspection by
17u/pixel high resolution camera. Wide 35x26 mm Field of View
achieves 4 times larger view area versus previous series of
CCD camera. |
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OVT-505 FOV 35 x 26mm
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This
greatly reduces the moving time of the camera and inspection
is shortened significantly. |
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Middle Illumination
Side Illumination
Coaxial Illumintation |
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3
Types of Illumination Mode
- Middle Illumination -
component inspection.
- Side Illumination - Laser Marking Inspection
- Coaxial Illumination - Solder Inspection. |
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Greatly
Reduced Image Distortion
By using specially
developed camera, lens and mirror arrangement, image
distortion at the edges of conventional system is eliminated. |
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Simple
Loading by Conveyor
Equipped with standard
automatic width adjustment, model change setup and PCBA
loading are easily done. |
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User
Friendly Operation and Inspection Program Making
WIndowsXP operating system. Inspeciton program is made by
moving camera to target components of good board and
registering its images. Everyone can master this simple
programming. Moreover, programming time can be much reduced
with editable parts library and combining external CAD and
mounter data etc. |
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Highly
Accurate Inspection
- High speed pattern
matching with normalized correlation process -> for
Components Inspection.
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Pixel counting at solder area by 2D -> for Solder
Inspection.
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Density inspection by B&W gray scale - for IC Lead Solder
Bridge Inspection.
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Color Check -> Check the color difference by measuring the
R,G,B balance of component. |
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Specification Subject To
Change Without Notice |
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Click here for
more spec.. |
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