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| Okano
Solder Paste Mixer |
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Introduction |
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>
Introduction
> Features
> Specification
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Solder
structure is interfered if it contains air bubbles that cannot
be |
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seen
from the outside. This will cause the tine wall to collapse
during |
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printing
process. In addition, the tensile force will cause open
circuit |
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during
reflow soldering. This is especially critical on high density
PCB. |
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If
solder paste is agitated over violently, the rate of
temperature rise |
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will
be too fast thus causing oxidization and solder joint quality
will |
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decrease.
Hence, mixing speed should not be so quick that mixing |
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quality
is compromised. Violent mixing method is not suitable for
solder |
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paste
and only gentle and smooth mixing method can achieve best |
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mixing
result. |
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Horizontal
Mounting of Solder Paste Container during Mixing |
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Solder
paste container lies horizontally in the rotating mechanism
will |
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cause
solder paste in the container vigorous mixing. Solder
paste |
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temperature
will rise quickly and cause solder paste to oxidize. Tin ball |
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granule
structure will be damaged on impact and air is also drawn in |
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the
solder paste during rotation. |
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It
causes solder paste to collapse during printing and will cause
open |
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circuit
and cold solder during reflow soldering |
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G-5000A
Adopts 45 Degree Mounting of Solder Paste Container |
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G-5000A
Mixing system makes use of interaction of centrifugal force |
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created
by revolution and the force created by the 45 degree angle |
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between
the main axis and the rotation axis. These forces cause the |
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solder
paste in the top of the container to press downward |
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continuously
while the solder paste in the bottom part of the |
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container
to move upward circumferentially. This cause a cyclone like |
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mixing
action and will mix the solder paste to suitable viscosity
gently. |
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Generally,
mixer with de-bubble function must turn off rotation and |
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only
makes use of centrifugal force of revolution to produce
de-bubble |
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result.
G-5000A adopts same direction of revolution and rotation and |
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applies
centrifugal spin to expel air to the top. This will not draw
air |
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into
solder paste and produce high quality mixing result. |
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Why
is G-5000A most suitable for lead-free and high density PCBA |
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As
the G-5000A adopts gentle and equal mixing method, the mixed |
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solder
paste has the following properties :- |
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Good Moistening Feature |
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Equal Dispersion Feature |
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Excellent Printing Result |
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Best Pro-Reflow Feature during Reflow Soldering |
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Will not draw Air Bubble. |
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Click
here for more spec ... |
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