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BGA.CSP
Rework Device
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R-Stand-H
(Heating Section)
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R-Stand-H
(Heating Section)
Function to attach and detach BGA or CSP by heated gas.
Features
- BGA package is uniformly convection-heated with the
spiral discharge system top heater and special reflow
nozzle.
- BGA/proximity electronic parts are not damage.
- High speed temperature profile control by PID method.
- Positioning of special work holder in accordance with
the printed board.
- Simple one-touch panel operation.
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R-Stand-H
Specification
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Machine Dimension
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500 (W) * 500 (D) * 610
(H) mm
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Weight
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30 Kg
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Power Source
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AC200V Single Phase
(50/60 Hz)
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Power Consumption
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4 KVA Max.
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Dry Air/N2
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0.5 MPa (Max. 400l/min)
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Work Specification
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Board Size
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Special work holder
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Board Thickness
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About 0.2 ~ 3.2 mm
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Applicable Board
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Equivalent to FR-4 ~
FR-5
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Package Type
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BGA, CSP, MCM, FC, BCC,
etc.
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Package Size
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50 mm square max.
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R-Stand-M
(Mount Section)
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R-Stand-M (Mount
Section)
BGA ball section is combined with PCB foot print section
by the prism optical system for correct positioning.
Clear composite image can be obtained by optical fiber
illumination that can adjust light volume.
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Printer
Kit Orbit
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Printer Kit Orbit
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Function to deposit the
solder paste ball onto the BGA, CSP etc.
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- Metal mask can be
replace and clean easily.
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- Solder paste ball can
be drop into the metal mask easily.
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Printer Kit Orbit
Specification
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Package Type
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Surface installation
type area package
(BGA, CSP, BCC, LGA etc)
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Package Size
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3 x 3 ~ 50 x 50 mm
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Ball (Pad) Pitch
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0.3 ~ 1.5 mm
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Ball (Pad) Diameter
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Ø 0.15 ~ Ø 0.9 mm
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Manual Position
Adjustment Accuracy
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X, Y, Z axis 0.01mm, ø
axis 0.03°
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External Dimension
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420 (W) x 200 (D) x 230
(H) mm
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Weight
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8 Kg
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Supply Air Pressure
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0.4 ~ 0.7 MPa
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Air Flow Rate
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15 l/min
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